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TOWER SEMICONDUCTOR LTD. (TSEM)

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Business overview

INFORMATION ON THE COMPANY A. HISTORY AND DEVELOPMENT OF THE COMPANY We are a pure-play independent specialty foundry, and as such we are dedicated to providing high-value, high-quality, processed wafers to our customers for their end products and end users. Our foundry processes use chemical materials, chemical processes and other materials and equipment on silicon wafers, based on the design specifications of our customers. As a pure-play foundry, we do not offer products of our own. We currently offer process technology geometries of 0.35, 0.18, 0.16 and 0.13 -micron on 200-mm wafers and 65 nanometer on 300-mm wafers. We also provide design support and complementary technical services.

Our customers and/or our customers’ customers use our wafers in their end products, which are sold and/or used in diverse markets, including consumer applications, personal computers, communications, data centers, handsets and smartphones, automotive, industrial, aerospace and medical devices. We are focused on establishing leading market share in high-growth specialized markets by providing our customers with high-value, high quality, wafer foundry services. We use standard analog CMOS process technology, as well as specialized specific technologies including CMOS image sensors, non-imaging sensors, micro-electromechanical systems (MEMS), wireless antenna switch Silicon-on-Insulator (SOI), mixed-signal, radio frequency CMOS (RFCMOS), bipolar CMOS (BiCMOS), silicon-germanium BiCMOS (SiGe BiCMOS or SiGe), silicon photonics (SiPho), including silicon and advanced low-loss silicon nitride waveguides, high voltage CMOS, and power management technologies.

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To better serve our customers, we have developed and are continuously expanding our technology offerings in these fields. Through our experience and expertise gained during more than thirty years of operation, we differentiate ourselves by creating a high level of value for our customers through innovative technological processes, design and engineering support, competitive operational indices, and dedicated customer service. 22 Tower Semiconductor Ltd., an Israeli company, was founded in 1993 with the acquisition of National Semiconductor’s 150-mm wafer fabrication facility located in Migdal Haemek, Israel, known as our Fab 1 facility, and commenced operations as an independent foundry. During 2025, in response to anticipated changes in market dynamics and customer demand, we discontinued operations at Fab 1 and consolidated certain flows into Fab 2, also located in Migdal Haemek, Israel, in order to streamline our production processes and enhance our overall efficiency.

We are currently commencing use of some of the Fab 1 facility for the expansion of certain Fab 2 activities. In 2003, we commenced production at Fab 2, a wafer fabrication facility we established in Migdal Haemek, Israel. Fab 2 currently supports geometries of 0.18- and 0.13-micron, utilizing advanced CMOS technology, including SiGe, SiPho, CMOS image sensors, magnetic sensors, advanced analog, RF (radio frequency) - specifically RF switches on SOI - power ICs, power discrete, and mixed-signal technologies. In 2008, we merged with Tower NPB, which holds 100% of NPB Co. and operates Fab 3, located in Newport Beach, California, U.S. Fab 3 specializes in specialty process technologies for silicon photonics and analog and mixed-signal semiconductor devices, and supports geometries ranging from 0.50- to 0.13-micron.

NPB Co.’s specialty process technologies support applications requiring advanced analog, radio frequency, high voltage, bipolar, SOI, silicon germanium bipolar complementary metal oxide (BiCMOS), and silicon photonics processes. In 2014, we acquired from Panasonic 51% of a newly established company, TPSCo, which became a foundry for the sale of wafers to Panasonic and other third-party customers, using three factories established by Panasonic in Hokuriku, Japan (Uozu E, Tonami CD and Arai E). Pursuant to the transaction, Panasonic transferred its capacity tools (8 inch and 12 inch) at these three fabs to TPSCo. TPSCo focuses on 65nm and 180nm geometries for RF, power management and CMOS image sensor wafers, products and applications.

In July 2022, the operations in Japan were reorganized and restructured such that the Arai factory, which solely served NTCJ and did not serve Tower or TPSCo foundry customers, ceased operations, while the operations at the Uozu and Tonami facilities remained unchanged. In March 2026, we signed an agreement for a strategic restructuring of our Japan operations, under which Tower will take full ownership of the 300mm Fab 7 to be organized under a wholly owned Japanese subsidiary of Tower, while NTCJ will take full ownership of the 200mm Fab 5. As part of this restructuring, the companies will enter into mutual long-term supply agreements to ensure continued support for the existing customers of both companies.

[…]

Source: 20-F · Period ended December 31, 2025 · View report

Latest developments

Recent company filings, newest first. Excerpts retain the original wording.

September 23, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

MIGDAL HAEMEK, Israel, - Sept 23, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its 2026 Technical Global Symposium (TGS), to be held on November 17, 2026, in Santa Clara, California, USA. Bringing together customers, partners and industry leaders, the event will explore technologies and market trends driving and shaping the evolution of AI infrastructure, high-performance computing, advanced connectivity, and intelligent sensing. Attendees will have the opportunity to engage directly with Tower’s executive leadership, technology experts, and ecosystem partners.

Following the highly successful 2026 Technical Global Symposium in Shenzhen, China, the U.S. event marks Tower’s second Technical Global Symposium of the year, underscoring the Company’s commitment to deep global customer engagement, industry collaboration and technology leadership across key semiconductor markets.

The event will feature a CEO keynote session highlighting the Company’s growth, strategic roadmap, and pivotal role in today’s semiconductor landscape, as well as an executive industry panel featuring senior leaders from leading technology companies. Featured panelists include Oliver Sun , CTO, Terahop; Hong Liu , VP & Fellow, Google AI22; Julie Sheridan Eng , CTO, Coherent; and Andy Bechtolsheim , Founder and Chief Architect, Arista.

The panel will examine the evolution of next-generation data center architectures and the technologies enabling the rapid expansion of AI-driven infrastructure. Panelists will share perspectives on the opportunities, challenges, and semiconductor innovations required to support future computing and connectivity demands.

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September 17, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Companies commercialize scale manufacturability of 800G to 1.6T PICs in external pluggable and CPX MSA compliant

NPO socket pluggable solutions built on PH18DA platform designed for high-density monolithic laser integration,

MIGDAL HAEMEK, Israel, and TEL AVIV, Israel, September 17, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, and NewPhotonics ®, a fabless semiconductor delivering innovative photonic IC chip solutions, today announced high-volume shipment of laser-integrated serviceable optical engines designed to meet the urgent and growing demand for high-bandwidth, energy-efficient optical interconnects in artificial intelligence infrastructure.

The PIC optical engine chips support OEM solutions ranging from FRO/LRO/LPO and Extra-Dense Packaged Optics (XPO) pluggable transceiver modules and Near-Packaged Optics (NPO) socket pluggable applications. Shipping volume production PICs today support data rates from 800G to 1.6T, with future volume manufacturing planned at 6.4T NPO solutions suitable for scale-out and scale-up architectures.

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September 15, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Tower Semiconductor to Highlight its High-Volume Silicon Photonics and SiGe Solutions for AI Infrastructure, Telecom and Emerging Applications at ECOC 2026

MIGDAL HAEMEK, Israel, September 15, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced its participation in upcoming ECOC 2026, taking place September 21–23, 2026 at FYCMA, Malaga, Spain, booth #C1014 . During the event days, company representatives will be available for meetings to discuss current and future silicon photonics roadmap.

Tower will showcase its high-volume and high-performance Silicon Photonics platform, widely utilized across the industry for datacenter and telecom optical transceivers, as well as for high-growth applications, including near- and co-packaged optics (NPO/CPO) for next-generation AI cluster architectures, DWDM lasers, optical circuit switching, FMCW LiDAR for Physical AI, and quantum computing. The company will also feature its Silicon Germanium (SiGe) BiCMOS solutions, which complement its SiPho platform to address the higher-bandwidth, lower-latency and lower-power demands of next-generation AI infrastructure.

To learn more about Tower’s advanced silicon photonics (SiPho) platform and RF & HPA technology offerings, visit here .

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August 17, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F.

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On August 17, 2026, the Registrant issued unaudited condensed interim consolidated financial statements as of June 30, 2026, and for the six- and three-month periods then ended. Attached hereto are the following exhibits.

This Form 6-K, including all exhibits hereto, is hereby incorporated by reference into the Registrant’s Registration Statements on Form S-8 (Registration Nos. 333-204173 and 333-277536).

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

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August 12, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

MIGDAL HAEMEK, Israel, August 12, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced that its company representatives will participate in the 2026 Jefferies Semiconductor, IT Hardware and Communications Technology Conference on Tuesday, August 25 th and Wednesday, August 26 th , and the Benchmark-StoneX 13 th Annual Tech, Media and Telecom Conference on Thursday, September 10 th .

The Jefferies Semiconductor, IT Hardware and Communications Technology Conference will take place at the Four Seasons Hotel in Chicago. The Benchmark-StoneX 13 th Annual Tech, Media and Telecom Conference will take place at the New York Athletic Club in New York. There will be an opportunity for investors to meet one-on-one with company representatives. Interested investors should contact the conference organizers or email the investor relations team at towersemi@kcsa.com .

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. […]

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August 11, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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On August 11, 2026, the Registrant and OpenLight Expanding PH18DA Photonics Ecosystem to Accelerate Photonic IC Development

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

OpenLight’s PDK is now available on Cadence’s EDA tools, enabling PIC development on Tower’s PH18DA InP-on-silicon

SANTA BARBARA, Calif., and MIGDAL HAEMEK, Israel, - August 11, 2026 - OpenLight , a leader in heterogeneous III‑V‑on‑silicon photonic integration and custom Photonic Application‑Specific Integrated Circuits (PASICs), and Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced the availability of OpenLight’s photonic Process Design Kit (PDK) for Tower Semiconductor’s PH18DA indium phosphide (InP)-on-silicon photonics platform in Cadence’s electronic design automation (EDA) tools. Developed through close technical collaboration between the companies, the PDK now enables customers to design advanced photonic integrated circuits (PICs) within a widely adopted IC design environment and accelerate development toward production. The PH18DA ecosystem brings together OpenLight’s photonics IP, Tower’s process and manufacturing expertise, and Cadence’s leading EDA tools, enabling a streamlined path for developing advanced photonic ICs while bringing photonics design closer to established electronic IC workflows and manufacturing. […]

OpenLight is a leader in the heterogeneous integration of III-V devices in silicon photonics. OpenLight’s world-leading PASIC technology, supported by its process design kit (PDK), integrates all active and passive components of silicon photonics devices into a single chip, enabling high-performance, energy-efficient photonics solutions across datacom, telecom, automotive, AI, and quantum computing applications and markets. The company’s recent $50 million Series A-1 funding round, bringing total funding to $84 million, reflects growing commercial momentum and accelerating customer adoption across next-generation photonics applications. The company is headquartered in Santa Barbara, California, with offices in Silicon Valley. Read more at www.openlightphotonics.com .

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August 4, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F.

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On August 4, 2026, the Registrant announced its financial results for the six and three months ended June 30, 2026. Attached hereto is the following exhibit.

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

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July 14, 2026Company update6-K

6-K company update

Original filing excerpt

REPORT OF FOREIGN PRIVATE ISSUER PURSUANT TO RULE 13a-16 OR 15d-16 OF THE SECURITIES EXCHANGE ACT OF 1934

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Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

On July 14, 2026, the Registrant Announces Tower Semiconductor with METI Support Announces Strategic Capacity Expansion in Japan

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Significant Multiples of Silicon Photonics and Silicon Germanium Capacity to Support Accelerating Customer Demand

MIGDAL HAEMEK, Israel, July 14, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced a parallel dual-track strategic expansion of its 300mm Silicon Photonics (SiPho), Silicon Germanium (SiGe), and advanced packaging capabilities in Japan, with support from the Government of Japan. The expansion is designed to support the rapidly growing long-term customer demand, substantially increasing the Company’s manufacturing capacity and extending its technology leadership.

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July 7, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

MIGDAL HAEMEK, Israel – July 7, 2026 – Tower Semiconductor (NASDAQ/ TASE: TSEM ), the leading foundry of high value analog semiconductor solutions, will issue its second quarter 2026 earnings release on Tuesday, August 4, 2026. The Company will hold a conference call to discuss its second quarter 2026 financial results and third quarter 2026 guidance on Tuesday, August 4, 2026, at 10:00 a.m. Eastern Time (09:00 a.m. Central, 08:00 a.m. Mountain, 07:00 a.m. Pacific and 05:00 p.m. Israel time).

The call will be webcast and available through the Investor Relations section of Tower Semiconductor’s website at https://ir.towersemi.com/ , where the pre-registration form required for dial-in participation is also accessible. Upon completing the registration, participants will receive the dial-in details, a unique PIN, and a confirmation email with all necessary information. The teleconference will be available for replay for 90 days.

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. […]

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July 6, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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At the annual general meeting of the shareholders of Tower Semiconductor Ltd. (the “Company”) held on July 2, 2026, a quorum was present and the shareholders voted on each of the proposals described in the Company’s proxy statement for the meeting, which was furnished as Exhibit 99.1 to a Report of Foreign Private Issuer on Form 6-K filed by the Company with the U.S. Securities and Exchange Commission on May 21, 2026. All proposals were approved at the meeting by the requisite majority under the Israeli Companies Law 5759-1999, with the exception of Proposal 3 (approval of an amended and restated compensation policy for the Company’s directors and executive officers). The Company’s Compensation Committee and Board of Directors will review the voting results and consider the appropriate next steps with respect to this matter. […]

All previously approved director and officer compensation arrangements, including any director and officer compensation approved by the shareholders at the meeting, will remain in effect, and the approval of any future officer and/or director compensation will be subject to approval in accordance with applicable law.

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

TOWER SEMICONDUCTOR LTD. Date: July 6, 2026 By: /s/ Nati Somekh Name: Nati Somekh Title: Corporate Secretary

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June 22, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Tower Semiconductor Ltd. (“Tower”) issued a letter to shareholders on June 22, 2026 (the “Letter to Shareholders”), which contains supplemental information to the proxy statement for its Annual General Meeting of Shareholders to be held on July 2, 2026 that was attached as Exhibit 99.1 to the Report of Foreign Private Issuer on Form 6-K furnished by Tower to the U.S. Securities and Exchange Commission (“SEC”) on May 21, 2026. A copy of the Letter to Shareholders is furnished herewith as Exhibit 99.1 to this Report of Foreign Issuer on Form 6-K.

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

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June 18, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

Tower’s advanced silicon photonics platform enables high-bandwidth, energy-efficient data center connectivity

MIGDAL HAEMEK, Israel, June 18, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced a significant milestone. The company, in partnership with Marvell Technology, has shipped over five million coherent photonic integrated circuits (PICs) to Marvell global customers, delivering advanced, high-performance photonics solutions to address the growing bandwidth and efficiency demands of AI-driven data center interconnect (DCI) networks.

Coherent PICs are complex because they must control the phase and polarization of light, not just the amplitude. The design and process requirements for these PICs are far more stringent compared to simpler direct-detect chips.

“As optical transceiver applications and requirements continue to evolve, photonics platforms must evolve to meet these requirements. This is especially true in the area of coherent optical transceivers,” said Dr. Ed Preisler, Vice President and General Manager of the RF Business Unit at Tower Semiconductor . “We are proud to collaborate with Marvell to stay at the forefront in this field.”

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June 15, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

CARDIFF, UK, and MIGDAL HAEMEK, Israel, June 15 2026 - IQE plc (AIM: IQE, "IQE" or the "Group"), the leading global supplier of compound semiconductor wafer products and advanced material solutions, and Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, are pleased to announce a multi-year agreement for the supply of Indium Phosphide (InP) epiwafers for optical connectivity solutions serving AI-driven data centre infrastructure.

IQE’s InP epiwafers will be used in several of Tower’s advanced silicon photonics platforms for next-generation optical technologies, providing a high-quality supply base for Tower’s product roadmap. IQE and Tower’s collaboration includes technology for the production of 200Gbs/lane for pluggable transceivers and the prototyping of next-generation 400Gb/lane modulators, as well as other critical applications including optical-circuit-switches for deployment in datacentres. The agreement provides for a minimum purchase commitment by Tower in the first year, a reciprocal supply commitment from IQE, and minimum volume commitments thereafter.

Under a separate agreement, Tower will also provide a broad worldwide and royalty-free license to IQE for porous silicon patents which have been the subject of an IP dispute between the companies, settling all litigation in the matter.

“ I am pleased to move forward together with Tower, already the leader in silicon photonics. This agreement reinforces IQE’s position within Tier 1 global hyperscale cloud and AI infrastructure markets. With decades of InP epitaxy expertise and established high-volume manufacturing capability, IQE is primed to support next-generation optical connectivity applications as they scale from innovation to commercial deployment.”

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May 21, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover Form 20-F or Form 40-F.

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The Registrant will hold its Annual General Meeting of Shareholders on July 2, 2026 at 3 p.m. (Israel time) at the Registrant’s offices in Migdal Haemek, Israel. In connection with the meeting, the Registrant will mail to holders of record of the Registrant’s ordinary shares, as of the close of business on May 26, 2026 (i) a Notice of Annual General Meeting and Proxy Statement and (ii) a Proxy Card.

Attached hereto as Exhibits 99.1 and 99.2 are, respectively, the (i) Notice of Annual General Meeting and Proxy Statement and (ii) Proxy Card.

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

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May 13, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

MIGDAL HAEMEK, Israel, May 13, 2026 - Tower Semiconductor (NASDAQ/TASE: TSEM), the leading foundry for high-value analog semiconductor solutions, today announced it has signed Silicon Photonics (SiPho) contracts for $1.3 billion for 2027 revenue with its largest customers, and the receipt of $290 million in customers’ prepayments for capacity reservation. This initial commitment is further reinforced by an even larger contractual wafer commitment for 2028 for which additional associated prepayments are due by January 2027. These financial commitments underscore Tower's market leadership and highlight the critical role of its world-leading Silicon Photonics technology platform in meeting the rapidly growing industry demand.

The pre-paid capacity reservation is the customer contractual commitment, with their full demand and Tower shipment forecast being higher. The total 2027 customer demand is further augmented by healthy forecasts from the rich and broad SiPho customer base of over 50 active customers across wide-ranging SiPho based applications.

To support this accelerating demand, Tower is in the midst of substantial capacity ramp to expand its worldwide multi-fab SiPho capacity, the foundation to achieve the 2028 model of $2.8 billion revenue with $750 million net profit in 2028.

“These long-term agreements further strengthen Tower’s strategic position at the center of the rapidly expanding optical connectivity market,” said Russell Ellwanger, Chief Executive Officer of Tower Semiconductor. “These multi-year customer commitments underscore both the depth of our strategic partnerships and our customers’ strong confidence in Tower’s ability to execute on a differentiated, multi-generational silicon photonics technology roadmap addressing the accelerating performance demands driven by AI infrastructure growth. With our unique manufacturing scale, technology breadth, and expanding global capacity, we are well positioned to support the market across today’s high-volume pluggable optical transceivers as well as next-generation Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO) solutions, enabling the continued scaling of data center bandwidth, power efficiency, and connectivity performance.”

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May 13, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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On May 13, 2026, the Registrant announced its financial results for the three months ended March 31, 2026. Attached hereto is the following exhibit.

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

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May 5, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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On May 5, 2026, Standard & Poor’s Maalot (an Israeli rating company which is fully owned by S&P Global Ratings) completed its annual rating review of the Registrant, re-affirmed its corporate credit rating as “ilAA”, and revised the rating outlook from Stable Outlook to Positive Outlook. S&P Maalot's official rating report in Hebrew has been submitted by S&P Maalot to the Israel Securities Authority and the Tel Aviv Stock Exchange and is available on the Tel Aviv Stock Exchange website. An unofficial English translation of the report prepared by S&P Maalot is available on the IR webpage (https://ir.towersemi.com/) on the Company’s website.

Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

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May 4, 2026Company update6-K

6-K company update

Original filing excerpt

Indicate by check mark whether the registrant files or will file annual reports under cover of Form 20-F or Form 40-F.

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Pursuant to the requirements of the Securities Exchange Act of 1934, the registrant has duly caused this report to be signed on its behalf by the undersigned, thereunto duly authorized.

MIGDAL HAEMEK, Israel, May 4, 2026 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced that company representatives will participate in several upcoming investor conferences in May and June:

There will be an opportunity for investors to meet one-on-one with company representatives at these conferences. Interested investors should contact the conference organizers or email the investor relations team at towersemi@kcsa.com .

Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM), the leading foundry of high-value analog semiconductor solutions, provides technology, development, and process platforms for its customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, medical and aerospace and defense. Tower Semiconductor focuses on creating a positive and sustainable impact on the world through long-term partnerships and its advanced and innovative analog technology offering, comprised of a broad range of customizable process platforms such as SiPho, SiGe, BiCMOS, mixed-signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors, displays, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides world-class design enablement for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies. […]

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Latest results

No quarterly report is available from the source. Showing the available annual report.

20-F Period ended: December 31, 2025 Filed: April 30, 2026View report

Original excerpts. Reporting periods, units and comparisons are retained in the text.

Revenue

Our customers and/or our customers’ customers use our wafers in their end products, which are sold to and/or used in diverse markets, including consumer applications, personal computers, wireless and wired communication (including data centers), imaging, automotive, industrial, aerospace and medical devices. The technology platforms we offer are focused on the mega trends of seamless connectivity, green initiatives and interactive smart systems. For the year ended December 31, 2025, our revenues were derived from customers located around the globe, of which 42% were located in the United States, 13% in Japan, 39% in Asia (excluding Japan) and 6% in Europe, as compared to 42%, 16%, 33% and 9%, respectively, for the year ended December 31, 2024.

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For the year ended December 31, 2025, 11% of our revenues were derived from NTCJ, 39% of our revenues were derived from an additional seven customers, each comprising between 4% to 7% of our revenues, and the remaining 50% of our revenues were derived from many other smaller customers, as compared to 13% derived from NTCJ, 27% derived from an additional four customers, each comprising between 3% to 11% of our revenues, and the remaining 60% derived from many other smaller customers for the year ended December 31, 2024. In order to attract and retain our customers, in 2025 and 2024, we made gross investments of $444 million and $436 million, respectively, in property and equipment across the fabs in Israel, Italy, the United States and Japan.

Cash flow & liquidity

During the year ended December 31, 2025, the USD appreciated against the Euro by 12.8%, compared to a 5.9% depreciation during the year ended December 31, 2024. 44 B. LIQUIDITY AND CAPITAL RESOURCES As of December 31, 2025, we had an aggregate of $235.4 million in cash and cash equivalents, as compared to $271.9 million as of December 31, 2024. The principal cash flow items for the year ended December 31, 2025 were as follows: $395.5 million of net cash provided by operating activities; $436.5 million invested in property and equipment, net; comprised of $444.4 million total investments and $7.9 million of proceeds related to sale and disposal of property and equipment $38.5 million received from sales of short-term deposits, net; and $33.4 million of net cash used in financing activities.

Management commentary

OPERATING AND FINANCIAL REVIEW AND PROSPECTS The information contained in this section should be read in conjunction with our audited consolidated financial statements and the related notes thereto contained in this annual report. Our financial statements have been prepared in accordance with U.S. GAAP. The following discussion and analysis may contain forward-looking statements that involve risks and uncertainties. Our actual results and the timing of selected events could differ materially from those anticipated in these forward-looking statements as a result of various factors, including those set forth under “Item 3. Key Information—D.

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Risk Factors” and elsewhere in this annual report. 39 A. OPERATING RESULTS OVERVIEW We are a pure-play independent specialty foundry dedicated to providing wafers and engineering services based on the design specifications of our customers. As a pure-play foundry, we do not offer products of our own. We currently offer process technology geometries mainly consisting of 0.35, 0.18, and 0.13-micron on 200-mm wafers and 65 nanometer on 300-mm wafers. We also provide design support and complementary technical services.

Our customers and/or our customers’ customers use our wafers in their end products, which are sold to and/or used in diverse markets, including consumer applications, personal computers, wireless and wired communication (including data centers), imaging, automotive, industrial, aerospace and medical devices. The technology platforms we offer are focused on the mega trends of seamless connectivity, green initiatives and interactive smart systems. For the year ended December 31, 2025, our revenues were derived from customers located around the globe, of which 42% were located in the United States, 13% in Japan, 39% in Asia (excluding Japan) and 6% in Europe, as compared to 42%, 16%, 33% and 9%, respectively, for the year ended December 31, 2024.

For the year ended December 31, 2025, 11% of our revenues were derived from NTCJ, 39% of our revenues were derived from an additional seven customers, each comprising between 4% to 7% of our revenues, and the remaining 50% of our revenues were derived from many other smaller customers, as compared to 13% derived from NTCJ, 27% derived from an additional four customers, each comprising between 3% to 11% of our revenues, and the remaining 60% derived from many other smaller customers for the year ended December 31, 2024. In order to attract and retain our customers, in 2025 and 2024, we made gross investments of $444 million and $436 million, respectively, in property and equipment across the fabs in Israel, Italy, the United States and Japan.

KEY FACTORS AFFECTING OUR RESULTS The following are key factors that impact our results of operations: Ability to attract and retain customers. We are a trusted, customer-oriented service provider that has built a solid reputation in the foundry industry for over thirty years. We have built strong relationships with our customers. Our consistent focus on providing high-quality, value-add services, including engineering and design support, has allowed us to attract customers seeking to work with a proven provider of foundry solutions. Our emphasis on close collaboration with customers, and on accelerating time-to-market and the performance of their next-generation products, has enabled us to maintain a high customer retention rate while increasing the number of new customers and products.

We continuously aim to expand our capacity footprint and business by addressing the future needs of our existing customers and attracting new customers that will utilize our existing facilities, some of which have recently undergone additional capacity expansion projects. We seek to acquire external capacity through acquisitions of existing fabs or by establishing new fabs, as we have done in the past, independently or through third-party collaborations, utilizing existing resources or additional funding (which may include cash, equity or in-kind investment). We also offer a wide range of support services for the establishment of new facilities or the ramp-up of existing facilities owned by third parties, using our technological, operational and integration expertise.

For these services, we receive payments based on the achievement of pre-defined milestones and may also be entitled to certain capacity allocation and other rights. 40 Design wins with new and existing customers. We work with our customers and potential customers to understand their product roadmaps and strategies. We consider design wins to be critical to our future success. We define a design win as the successful completion of the evaluation stage, where a customer has verified that our platform process meets its requirements and has qualified our libraries and IP for its products. The revenue generated from each design win can vary significantly.

[…]

Key risks

Annual risk disclosures

20-F Period ended: December 31, 2025 Filed: April 30, 2026View report

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Annual report details

Read annual management analysis & tone analysis
20-F Period ended: December 31, 2025 Filed: April 30, 2026View report

Annual MD&A Tone Analysis

+100.0
2 · 100.0%Positive terms
0 · 0.0%Negative terms
747Analyzed annual MD&A words

Only the extracted annual management discussion is evaluated using dictionary version 1.1. Score = (positive − negative) ÷ matched terms × 100. Quarterly reports and current filings are excluded. This lexical measure does not assess financial health and may not fully capture context or negation.

OPERATING AND FINANCIAL REVIEW AND PROSPECTS The information contained in this section should be read in conjunction with our audited consolidated financial statements and the related notes thereto contained in this annual report. Our financial statements have been prepared in accordance with U.S. GAAP. The following discussion and analysis may contain forward-looking statements that involve risks and uncertainties. Our actual results and the timing of selected events could differ materially from those anticipated in these forward-looking statements as a result of various factors, including those set forth under “Item 3. Key Information—D.

Risk Factors” and elsewhere in this annual report. 39 A. OPERATING RESULTS OVERVIEW We are a pure-play independent specialty foundry dedicated to providing wafers and engineering services based on the design specifications of our customers. As a pure-play foundry, we do not offer products of our own. We currently offer process technology geometries mainly consisting of 0.35, 0.18, and 0.13-micron on 200-mm wafers and 65 nanometer on 300-mm wafers. We also provide design support and complementary technical services.

Our customers and/or our customers’ customers use our wafers in their end products, which are sold to and/or used in diverse markets, including consumer applications, personal computers, wireless and wired communication (including data centers), imaging, automotive, industrial, aerospace and medical devices. The technology platforms we offer are focused on the mega trends of seamless connectivity, green initiatives and interactive smart systems. For the year ended December 31, 2025, our revenues were derived from customers located around the globe, of which 42% were located in the United States, 13% in Japan, 39% in Asia (excluding Japan) and 6% in Europe, as compared to 42%, 16%, 33% and 9%, respectively, for the year ended December 31, 2024.

For the year ended December 31, 2025, 11% of our revenues were derived from NTCJ, 39% of our revenues were derived from an additional seven customers, each comprising between 4% to 7% of our revenues, and the remaining 50% of our revenues were derived from many other smaller customers, as compared to 13% derived from NTCJ, 27% derived from an additional four customers, each comprising between 3% to 11% of our revenues, and the remaining 60% derived from many other smaller customers for the year ended December 31, 2024. In order to attract and retain our customers, in 2025 and 2024, we made gross investments of $444 million and $436 million, respectively, in property and equipment across the fabs in Israel, Italy, the United States and Japan.

KEY FACTORS AFFECTING OUR RESULTS The following are key factors that impact our results of operations: Ability to attract and retain customers. We are a trusted, customer-oriented service provider that has built a solid reputation in the foundry industry for over thirty years. We have built strong relationships with our customers. Our consistent focus on providing high-quality, value-add services, including engineering and design support, has allowed us to attract customers seeking to work with a proven provider of foundry solutions. Our emphasis on close collaboration with customers, and on accelerating time-to-market and the performance of their next-generation products, has enabled us to maintain a high customer retention rate while increasing the number of new customers and products.

We continuously aim to expand our capacity footprint and business by addressing the future needs of our existing customers and attracting new customers that will utilize our existing facilities, some of which have recently undergone additional capacity expansion projects. We seek to acquire external capacity through acquisitions of existing fabs or by establishing new fabs, as we have done in the past, independently or through third-party collaborations, utilizing existing resources or additional funding (which may include cash, equity or in-kind investment). We also offer a wide range of support services for the establishment of new facilities or the ramp-up of existing facilities owned by third parties, using our technological, operational and integration expertise.

For these services, we receive payments based on the achievement of pre-defined milestones and may also be entitled to certain capacity allocation and other rights. 40 Design wins with new and existing customers. We work with our customers and potential customers to understand their product roadmaps and strategies. We consider design wins to be critical to our future success. We define a design win as the successful completion of the evaluation stage, where a customer has verified that our platform process meets its requirements and has qualified our libraries and IP for its products. The revenue generated from each design win can vary significantly.

[…]

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